HOSON Planar High-speed Die Bonder HAD2610

HOSON Planar High-speed Die Bonder HAD2610

HAD2610（平面式高速固晶機）（週期：130ms）
適用于普通貼片，二極體，三極管等
機型特性
1. 採用國際領先的固晶，點膠，晶片搜尋系統；
2. 單邦雙臂結構，採用電機旋轉+音圈上下驅動固晶擺臂；
3. 採用絲杆伺服驅動搜尋晶片平臺（X/Y）與線性電機驅動送料平臺（B/C）；
4. 採用晶框自動校正晶片結構以及自動擴藍膜結構，相容6寸和8寸晶圓；
5. 採用新式恒溫點膠系統；
6. 採用真空漏晶檢測；
7. 兩種上料方式：疊料方式吸支架上料或料盒方式推支架進料，人性化操作，提高生產效率；
8. 收料採用：料盒方式收料，有效提高了生產效率；
9. 工控機控制設備運行，簡化了自動化設備的操作；
10. 精准的自動化設備為企業提高生產效率，降低成本提供了有效保障，從而切實有效地提高了企業競爭力；
11. 固晶位置精准及優良的一致性為後道工序提供了先天的保障。

HAD2610（Planar High-speed Die Bonder）（Cycle: 130ms）
Suitable for ordinary chip, diode, triode
Model Features
1. Adopt the international leading die-bonding, dispensing and wafer search system;
2. Single-bonder and double-arm structure, motor rotation + voice coil up and down to drive the solid-crystal swinging arm;
3. Using screw servo drive to search chip platform (X/Y) and linear motor drive feeding platform (B/C);
4. Adopt the crystal frame to automatically correct the wafer structure and automatically expand the blue film structure, compatible with 6-inch and 8-inch wafers;
5. Adopt the new constant temperature dispensing system;
6. Vacuum die missing test is adopted;
7. Two loading modes: stacking mode, suction bracket loading mode or material box mode, pushing bracket loading mode, humanized operation, improving production efficiency;
8. Material receiving: material box, effectively improving production efficiency;
9. IPC controls the operation of equipment, which simplifies the operation of automatic equipment;
10. Accurate automation equipment provides an effective guarantee for enterprises to improve production efficiency and reduce costs, thus effectively improving the competitiveness of enterprises;
11. Precise location and excellent consistency of die bonding provide innate guarantee for the later process.

商品編號 SKU： HAD2610