HOSON Fully Automatic Planer Die Bonder inline with second Die Bonder, Clip and Cutting Machine & Reflow Oven HAD810-DDCO

HOSON HAD810-DDCO
Fully Automatic Planer Die Bonder inline with second Die Bonder, Clip and Cutting Machine & Reflow Oven

HAD810-D1 （全自動平面固晶機）（週期： 250ms）
適用於IC類框架
機型特性
1. 直線電機驅動的雙點膠系統；
2. 高精度直線驅動固晶邦頭,音圈扭力環精確控制固晶壓力；
3. 高精度搜尋晶片平臺，伺服電機驅動晶片角度矯正系統，配備自動擴膜系統；
4. 採用點膠獨立控制系統，膠量控制更加精確；
5. 採用真空漏晶檢測；
6. 工控機控制設備運行，簡化了自動化設備的使用方法；
7. 精准的自動化設備為企業提高生產效率，降低成本提供了有效保障，從而切實有效地提高了企業競爭力；
HAD810-D1（Fully Automatic Plenar Die Bonder）(Cycle: 250ms)
Suitable for IC leadframe
Modle Features
1. Linear motor-driven double dispensing system.
2. High precision linear driving die bond tieback,voice coil torsion loop accurately controls die bond pressure.
3. High-precision search chip platform, servo motor drive chip angle correction system, equipped with automatic film expansion system.
4. With separate dispensing control system, the glue quantity control is more precise.
5. Vacuum die missing testing technology is adopted.
6. IPC will control the operation of equipment,simplifying the usage of automation equipment.
7. Sophisticated equipment will help improve the enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness.
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HAD810-D2 （全自動平面固晶機）（週期： 250ms）
適用於IC類框架
機型特性
1. 直線電機驅動的雙點膠系統；
2. 高精度直線驅動固晶邦頭,音圈扭力環精確控制固晶壓力；
3. 高精度搜尋晶片平臺，伺服電機驅動晶片角度矯正系統，配備自動擴膜系統；
4. 採用點膠獨立控制系統，膠量控制更加精確；
5. 採用真空漏晶檢測；
6. 工控機控制設備運行，簡化了自動化設備的使用方法；
7. 精准的自動化設備為企業提高生產效率，降低成本提供了有效保障，從而切實有效地提高了企業競爭力；
HAD810-D2（Fully Automatic Plenar Die Bonder）(Cycle: 250ms)
Suitable for IC leadframe
Modle Features
1. Linear motor-driven double dispensing system.
2. High precision linear driving die bond tieback,voice coil torsion loop accurately controls die bond pressure.
3. High-precision search chip platform, servo motor drive chip angle correction system, equipped with automatic film expansion system.
4. With separate dispensing control system, the glue quantity control is more precise.
5. Vacuum die missing testing technology is adopted.
6. IPC will control the operation of equipment,simplifying the usage of automation equipment.
7. Sophisticated equipment will help improve the enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness.
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HAD810-C（CLIP裁切貼裝機）（週期：185ms）
適用於功率器件或IC晶片固定後的CLIP貼裝工藝
機型特性
1. Dispensing on DIE surface
採用獨立五點膠結構，每組點膠XYZ獨立運動，點膠互不干擾，結構緊湊，間距可調，數量可擴展，大大提高了點膠效率，每組點膠機構X/Y/Z向可調整方便調試維護
2. Clip attaching
高精密度沖切模具可保證切口毛刺小於0.05mm；刀具壽命可達1kk次；clipbond force參數化設定可保證晶片不受損
資料處理能力：
1. 點膠點和Clip安裝點位置/大小即時檢測表格顯示，位置/大小超出上下限報警停機
2. 點膠點和Clip安裝點位置/大小資料保存可追蹤查詢
3. 點膠點和Clip安裝點位置/大小資料統計功能，如cpk
4. 點膠點和Clip安裝點位置/大小資料檢測結果生成mapping供die attaching使用
HAD810-C (Clip and Cutting Machine) Cycle: 185ms
It is suitable for CLIP SMT technology after power device or IC chip is fixed
Product Features
1. Dispensing on DIE surface
Adopt independent five-point glue structure, each group dispensing glue XYZ moves independently, dispensing glue does not interfere with each other, compact structure, adjustable space, quantity can be expanded, greatly improve the efficiency of dispensing glue, each group dispensing glue X/Y/Z direction can be adjusted to facilitate debugging and maintenance.
2. Clip Attaching
The cutting burr is less than 0.05mm with the high-precision die-cutting mold; the tool life can reach to 1kk times; the clip bond force parameterization can protect the chip from damage.
Data processing capabilities:
1. Real time detection table display of the dispensing mark and clip mounting mark position/ size, auto-shutdown alarming system if position/size exceeds the upper or lower limits.
2. Dispensing mark and clip mounting mark position/ size data preservation for querying anytime.
3. Dispensing mark and clip mounting mark position/ size data statistics function, such as cpk.
4. Dispensing mark and clip mounting mark position/ size data detection results generate mapping for die attaching.
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HAD810-O（支架烘烤機）
適用於各種裸片式功率器件的焊接。
機型特性
1. 產能 = 10~30 Sec. / 每一片(按錫膏商建議的Profile)
2. 低耗電（升溫時26KW/保溫時2KW）；低耗氣(100升/分)
3. 無氧化焊接 (氮氣或氮氫混合氣)，含氧量20ppm以下
4. 同一溫區 溫差小於5˚C
5. 可程式化之溫度曲線設定
6. 即時溫度監控
7. 不卡料之料片傳送機構
優越性：
1. 爐體多溫區設計，包含上料區（1個）+加熱區（12個）+冷卻區（2個），溫度控制平滑，能夠完美擬合錫膏的升溫曲線.
2. 可選配含氧量檢測儀，即時監控爐內氧含量.
3. 爐體半封閉設計，可極大減小氮氣損耗，同時隔絕外部氣流干擾.
4. 氮氣進氣加熱功能：氮氣預熱到設定溫度再通入爐內，避免溫區溫度劇烈變化，影響爐內溫度曲線
5. 自動profile功能，系統可自動產生爐溫曲線，並可保存查詢
6. 選用高品質加熱管，保證同一溫區各點實測最高溫減最低溫小於或等於5℃
7. 爐體抽廢管道具有加熱功能，保證焊油不在管道內凝聚
8. 油煙處理，新型水濾式油煙收集方式，回流焊接時產生之廢氣經處理後可直排大氣。
9. 爐內腔體清潔簡單，保養週期 : 依錫膏品質/成份不同而異，如indium免清洗錫膏可一周清潔一次爐內腔體
HAD810-O (Reflow Oven)
Suitable for welding of all kinds of bare metal power devices.
Product Features
1. Capacity is 10~30 Sec. per piece (as recommended Profile by solder paste)
2. Low power consumption (26KW when warming up/2KW when keep warming); low gas consumption (100 liters/min)
3. No oxidation welding (nitrogen or nitrogen-hydrogen mixture), oxygen content below 20ppm
4. The temperature difference is less than 5˚C in the same temperature zone
5. Programmable temperature curve setting
6. Instant temperature monitoring
7. Unloaded web transfer mechanism
Superiority
1. Multi-temperature zone design of furnace body, including feeding zone (1) + heating zone (12) + cooling zone (2), temperature control is smooth, which can perfectly fit the temperature rise curve of solder paste.
2. It can be equipped with an oxygen detector for real-time monitoring of oxygen content in the furnace.
3. Semi-closed furnace design can greatly reduce nitrogen loss and isolate external airflow interference.
4. Nitrogen inlet heating function: Nitrogen preheats to the set temperature and then passes into the furnace, avoiding the drastic change of temperature in the temperature zone and affecting the temperature curve in the furnace.
5. Automatic profile function, the system can automatically generate furnace temperature curve, and can save the query.
6. Select high-quality heating tubes to ensure that the measured maximum temperature minus minimum temperature at each point in the same temperature area is less than or equal to 5℃.
7. The furnace body drainage pipe has heating function to ensure that the welding oil does not condense in the pipe.
8. Lampblack treatment, a new type of water filter lampblack collection method, the waste gas generated during reflow welding can be directly discharged into the atmosphere after treatment.
9. The furnace cavity is easy to clean, and the maintenance cycle is different according to the solder paste quality/ingredients. For example, indium clean-free solder paste can clean the furnace cavity once a week.

商品編號 SKU： HAD810-DDCO