HOSON Plane-type High-speed Die Bonder GTS-100AH-PA

GTS-100AH-PA（平面式高速固晶機）
（週期：50ms）
適用於2121,3014及2835,5050等
一、機型特性
1. 採用國際領先的雙固晶，雙點膠，雙晶片搜尋系統；
2. 採用直驅電機驅動邦頭；
3. 採用線性電機驅動搜尋晶片平臺（X/Y）與送料平臺（B/C）
4. 晶框採用自動角度修正系統；
5. 採用可程式恒溫點膠系統；
6. 採用真空漏晶檢測；
7. 採用自動式裝卸晶環系統、支架採用疊片式上料（免裝料盒），有效提高了生產效率；
8. 工控機控制設備運行，簡化了自動化設備的操作；
9. 精准的自動化設備為企業提高生產效率，降低成本提供了有效保障，從而切實有效地提高了企業競爭力；
10. 精准的固晶位置及優良的一致性為後道工序提供了先天的保障。

Plane-type High-speed Die Bonder
Cycle: 50ms
It is compatible with 2121、3014、2835 and 5050 etc.

Product Features
1. International leading double die bond, double adhesive dispense and double die searching system;
2. Linear motor is applied to drive bond head;
3. Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);
4. Automatic chip theta alignment system is applied on the Crystal frame;
5. Programmed control constant-temperature adhesive dispensing system is also applied;
6. Vacuum die missing testing technology is adopted;
7. Automatic installing & uninstalling crystal rings and stacking holders for loading (free-loading magazine) is applied to improve the production efficiency largely;
8. IPC will control the operation of equipment, simplifying the operation of automation equipment;
9. Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;
10. Precise die bond location and excellent compatibility will guarantee the back-end processing.

商品編號 SKU： GTS-100AH-PA