HOSON Sextuple-head Plane-type High-speed Die Bonder HAD8606-H

HAD8606-H（六頭平面式高速固晶機）
（單頭週期：135ms）
適用於Mini LED PCB
一、機型特性
1. 採用國際領先的六邦頭固晶，六個晶片搜尋系統；三個固晶平臺內部直接連線，同一基板同時一次性完成三種晶片固晶；
2. 採用直驅伺服電機驅動邦頭；
3. 採用線性電機驅動搜尋晶片平臺（X/Y）與送料平臺（B/C）；
4. 夾具平臺底部採用吸真空方式，PCB在真空的作用下達到固晶平面高度一致，提高固晶速度及固晶品質；
5. 採用真空漏晶檢測；
6. 採用自動式上下料，兩種方式相容進料（料盒進料，接駁台進料），以及料盒收料和接駁台接下一台設備兩種方式相容收料，很大程度提高了生產效率；
7. 晶片平臺增加自動換環功能，可以自動修正晶片角度；
8. 工控機控制設備運行，簡化了自動化設備的操作；
9. 精准的設備化設備為企業提高生產效率，降低成本提供了有效保障，從而切實有效地提高了企業競爭力；
10. 精准的固晶位置及優良的一致性為後道工序提供了先天的保障。

HAD8606-H
Sextuple-head Plane-type High-speed Die Bonder
Single-head Cycle: 135ms
It is compatible with Mini LED PCB
Product Features
1. International leading sextuple die bond, sextuple adhesive dispense and double die searching system; direct-wiring inside three die bond platforms, bonding three kinds of dies all at once on the substrate;
2. Linear motor is applied to drive bond head;
3. Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);
4. Vacuum picking method is adopted on the clamp base, uniformizing the bonding height of PCB to expedite the bonding and ensure the bonding quality simultaneously;
5. Vacuum die missing testing technology is adopted;
6. Automatic loading and unloading system, two ways of loading(by magazine or conveyor ) and receiving by magazine or the conveyor which connected to another machine, improving the production efficiency largely;
7. Adding automatic ring changing function on the die platform, correcting the die theta automatically;
8. IPC will control the operation of equipment, simplifying the usage of automation equipment;
9. Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;
10. Precise die bond location and excellent compatibility will guarantee the back-end processing.

商品編號 SKU： HAD8606-H